The Advanced IC Substrates Market was worth USD 7.73 Bn. in 2020, and it is forecasted to grow to USD 12.24 Bn by 2027, with a CAGR of 6.85 percent between 2022 and 2027.
Advanced IC Substrates Market size was valued at US$ 8.26 Bn. in 2021 and the total revenue is expected to grow at 6.85% through 2021 to 2027, reaching nearly US$ 12.29 Bn.
Market Overview
The Advanced IC Substrates Market was worth USD 7.73 Bn. in 2020, and it is forecasted to grow to USD 12.24 Bn by 2027, with a CAGR of 6.85 percent between 2022 and 2027. Players are always improving packaging technologies in order to meet their rigorous demands for a smaller footprint, higher performance, and lower power consumption. Consumer electronics and mobile communication device demand is driving electronics makers to create ever-smaller and more portable products.
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Market Scope
The research report evaluates the attractiveness of geographies and sectors based on the compound annual growth rate (CAGR) and size of the Advanced IC Substrates Market. Leading analysts and industry experts have scrutinized the results and data. The research looks at forecasted data, revenues generated, and major events in the Advanced IC Substrates Market. It also concentrates on key methods employed by well-known Advanced IC Substrates Market sector firms. This provides readers with up-to-date market data that is both relevant and thorough.
Data on market size, forecasted trends, market share, market dynamics, opportunities, threats, risks, and new entrants are presented in the report. To provide users with comprehensive information, all of the main aspects and analytical market data are scientifically displayed in the form of graphs, tables, pie charts, and product statistics.
Segmentation
Based on Type, Advanced IC Substrates Market is segmented into FC-BGA and FC-CSP. Due to its routing density availability and ability to be customized for maximum electrical performance, FCBGA is likely to capture a considerable part of market demand. Unimicron, ASE Group, IBIDEN, and SCC are the market's major participants. Unimicron and Kinsus, for example, are boosting their substrate capacities. Unimicron has announced that it will invest TWD 20 Bn in R&D and production capacity expansion for innovative flip-chip substrates until 2022. By Application, Advanced IC Substrates Market is segmented into Mobile & Consumer, Automotive & Transportation, IT & Telecom and Other Applications. The growing need for IC substrates is likely to be fueled by global IoT demand in both consumer and industrial markets. The Internet and Television Association estimates that the global number of IoT devices reached around 50.1 Bn by 2020, with industrial IoT demand projected to outpace consumer demand in the following years. Such changes are projected to have a favorable impact on the market.
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Key Players
• ASE Group (Taiwan)
• TTM Technologies (U.S.)
• KYOCERA Corporation (Japan)
• Eastern (U.S.)
• Ibiden (Singapore)
• AT&S (Austria)
• Nan Ya PCB (Taiwan)
• Semco (U.S.)
• Fujitsu (Japan)
• Daeduck (South Korea)
• Korea Circuit (South Korea)
• Shinko Electric Industries (Japan)
• Zhen Ding Technology (Cayman Islands)
• Unimicron (Taiwan)
• Kinsus (Taiwan)
• Shenzhen Fastprint Circuit Tech (China)
• Zhuhai ACCESS Semiconductor (China)
• Shennan Circuit (China)
• LG Innotek (South Korea)
• Simmtech (South Korea)
Regional Analysis
The study delves into the Advanced IC Substrates Market in depth, segmenting it into regions. For the analysis, a review of the provincial Advanced IC Substrates Market involved with the objective market, as well as results related to the objective market, is provided. The review evaluates the market in North America, South America, Europe, Asia Pacific (APAC), Africa, and the Middle East on a local and country-by-country basis. The market in each region is thoroughly investigated, enabling for the identification of regional market trends, restrictions, and development opportunities.
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Key Questions answered in the Advanced IC Substrates Market Report are:
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Mar 06, 2023
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