Demand for Die Bonder Equipment is projected to reach US$ 4.2 billion in 2022 and to increase to US$ 6.0 billion between 2022 and 2032 at a CAGR of 4%. Growth is being fueled by an increase in the use of stacked die technology in Internet of Things (IoT) devices.
Therefore, die bonder equipment is extensively used in the manufacturing of semiconductor devices. Furthermore, a variety of methods are used to attach the die to the substrate, including epoxy, eutectic, soft solder, and flip chips.
As a result, it is projected that die bonder equipment manufacturers would see profitable growth opportunities in the coming years, resulting in a significant CAGR for the die bonder equipment market.
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Global Die Bonder Equipment Market: Dynamics
One of the main elements anticipated to fuel future demand for die bonder equipment is the rise in demand for semiconductor integrated circuits. As more end-use applications embrace electronic systems, there will be a robust need for integrated circuits (ICs). In turn, this is driving up demand for die bonder machinery on the world market. In the future, it is also anticipated that the expanding use of IOTs, ultra-high definition television, and hybrid laptops will significantly increase demand for die bonder equipment. The future expansion of the die bonder equipment market is also anticipated to be hampered by the rising demand for polymer adhesive water bonding equipment.
Global Die Bonder Equipment Market: Regional Outlook
In the global market of die bounder equipment, Asia Pacific is expected to dominate the market owing to growing demand from the region. This growing demand can primarily be attributed to the presence of a huge number of IC manufacturers in the region. Growing IC demand due to increasing smartphones and tablets production will make the region grow at a healthy pace in future.
Moreover, the market for die bonder equipment in North America and Europe is also projected to grow at a healthy pace owing to increasing demand for semiconductors ICs from the region. The fast adoption of new and latest technologies in the region is also expected to drive the market in the region. Furthermore, MEA and Latin America are also expected to create demand for die bonder equipment in future as the market in these regions is in the growing stage as compared to other regions.
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Global Die Bonder Equipment Market: Market Participants
In the global die bonder equipment market, manufacturers are continuously focused towards automation of the tie bonding technology. Names of some of the manufacturers engaged in the development and manufacturing of die bonder equipment are mentioned:
- Besi
- ASM Pacific Technology Limited (ASMPT)
- Kulicke & Soffa Industries, Inc.
- Tresky AG
- SHIBAURA MECHATRONICS CORPORATION
- West·Bond, Inc.
- Panasonic Corporation
- MRSI Systems
- SHINKAWA LTD.
- Palomar Technologies
- DIAS Automation
- Toray Engineering
- FASFORD TECHNOLOGY
The research report presents a comprehensive assessment of the Die Bonder Equipment market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated Die Bonder Equipment market data. It also contains projections using a suitable set of assumptions and methodologies. The research report provides analysis and information according to Die Bonder Equipment market segments such as geographies, application, and industry.
Key Segments Profiled in the Die Bonder Equipment Industry Survey
Die Bonder Equipment Market by Product Type:
- Manual Die Bonder Equipment
- Semi-Automatic Die Bonder Equipment
- Fully Automatic Die Bonder Equipment
Die Bonder Equipment Market by Attachment Method:
- Epoxy Die Bonder
- Eutectic Die Bonder
- Soft Solder Die Bonder
- Flip Chip Die Bonder
Die Bonder Equipment Market by End User:
- Die Bonder Equipment for Integrated Device Manufacturers (DMs)
- Die Bonder Equipment for Outsourced Semiconductor Assembly and Test (OSAT)
Die Bonder Equipment Market by Region:
- North America Die Bonder Equipment Market
- Latin America Die Bonder Equipment Market
- Europe Die Bonder Equipment Market
- Asia Pacific Die Bonder Equipment Market
- Middle East & Africa Die Bonder Equipment Market
